It’s hard to say for certain whose final call it was to do this underfill (it’s a tossup between ATI’s design engineers and the packaging partner they chose to work with to get the TSMC chip into a final product), but at the end of the day it was ATI’s responsibility to validate the chip and ensure its reliability before shipping it off to Microsoft.
I thought tsmc chose the poor underfill.
It’s hard to say for certain whose final call it was to do this underfill (it’s a tossup between ATI’s design engineers and the packaging partner they chose to work with to get the TSMC chip into a final product), but at the end of the day it was ATI’s responsibility to validate the chip and ensure its reliability before shipping it off to Microsoft.
I always heard that was tsmc’s decision.