It’s hard to say for certain whose final call it was to do this underfill (it’s a tossup between ATI’s design engineers and the packaging partner they chose to work with to get the TSMC chip into a final product), but at the end of the day it was ATI’s responsibility to validate the chip and ensure its reliability before shipping it off to Microsoft.
It’s hard to say for certain whose final call it was to do this underfill (it’s a tossup between ATI’s design engineers and the packaging partner they chose to work with to get the TSMC chip into a final product), but at the end of the day it was ATI’s responsibility to validate the chip and ensure its reliability before shipping it off to Microsoft.
I always heard that was tsmc’s decision.